Speaker:

Dr. Murray Daw

Affiliation:

Clemson University, Clemson/South Carolina

Title:

A Random Walk Through the Field of Diffusion

This travelog is a personal account of adventures in materials simulation, begun when this academic had the opportunity to work for two years on microelectronics process development at Motorola. Several interesting problems related to diffusion in materials were encountered, leading to these research topics:
(i) Stress effects on dopant diffusion in Si
(ii) Diffusion in ordered alloys
(iii) Contribution of diffusion to creep in metals

In all of these, the basic question is how to use fundamental electronic structure calculations to understand macroscopic behavior of materials. The answer was found by G. K. Chesterton, who noted that "coincidences are spiritual puns."
The Seminar Page The Center for Simulational Physics Dep. of Physics and Astronomy The University of Georgia
©Andreas Voigt